SK Hynix announced a $12.85 billion investment to construct an advanced packaging manufacturing plant, P&T7, in Cheongju, South Korea. The facility will occupy a 230,000 sqm parcel within the Cheongju Technopolis Industrial Complex, featuring three floors of wafer-level packaging (WLP) process lines across 60,000 sqm and seven floors of wafer test (WT) process lines across 90,000 sqm. Construction is scheduled to begin later in April 2026, with the WT line expected to complete by October 2027 and the WLP line by February 2028. Once operational, P&T7 will employ approximately 3,000 workers, with peak construction employment reaching 9,000. The plant represents SK Hynix's fifth production facility in Cheongju, following M11, M12, M15, and M15X, and is positioned as the core production base to solidify the company's AI memory leadership.