Global Infrastructure SherpaSTMicroelectronics enters high-volume production of PIC100 photonics chip for hyperscalers
STMicroelectronics has entered high-volume production of its PIC100 data center photonics chip, designed to support 800Gbps and 1.6Tbps optical interconnects for AI workloads. The company is planning and executing capacity expansions to more than quadruple production by 2027, underpinned by long-term capacity reservation commitments from its hyperscaler customers. This move positions STMicroelectronics to support the AI infrastructure super-cycle with its 300mm manufacturing lines in Crolles, France.
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- PIC100 chip enables 800Gbps and 1.6Tbps optical interconnects for AI.
- Production to more than quadruple by 2027.
- Backed by long-term capacity reservations from hyperscaler customers.
- Manufacturing in Crolles, France, on 300mm lines.
Source Intelligence
The PIC100 chip supports 800Gbps and 1.6Tbps optical interconnects for AI workloads: "Dubbed the PIC100, the chip supports incoming 800Gbps and 1.6Tbps optical interconnects across all workloads, including artificial intelligence (AI)". The PIC100 TSV platform is designed to support future generations of near packaged optics (NPO) and co-packaged optics (CPO): "ST said the PIC100 TSV platform is designed to support future generations of near packaged optics (NPO) and co-packaged optics (CPO)". The company plans to more than quadruple production by 2027: "planning and executing on capacity expansions to enable more than quadrupling of production by 2027".
"European chip manufacturer STMicroelectronics has entered high-volume production of its data center photonics chip."
"ST is now entering high-volume production for leading hyperscalers."
Timeline
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